MLT Micro Laser Technology
Laser Excellence

Laser cutting - high-precision and economical machines

Laser cutting enables the high-precision separation of materials and the cutting of complex contours. It is suitable for both high-volume production and small batch sizes. Using a high-energy laser beam, the material is cut cleanly and precisely within the tightest tolerances, but at the same time at the highest cutting speeds. With its flexibility, cost efficiency and future viability, laser cutting is superior to conventional cutting processes in many respects.

Laser cutting is suitable for a wide range of materials

Laser cutting is suitable for a wide range of materials, from metals and ceramics to foils and paper. As a manufacturer of holistic laser machines, MLT has focused on laser cutting machines especially for roll goods and sheets. Exemplary materials here are filter media, nonwovens, adhesive tapes, foils, paper, cardboard, but also copper foil and aluminium foil.

One partner, all laser cutting processes

Depending on the application goals, the appropriate laser technologies are used as laser beam sources in the machine solution: These include CO2 lasers, solid-state lasers such as Nd:YAG lasers, fiber lasers or disk lasers. Whether laser beam cutting, micro laser cutting or laser fine cutting, with MLT you have a laser system manufacturer at your side who combines the latest technological innovations and many years of experience for your laser cutting machines.

Main applications in laser cutting Main applications in laser cutting:

Laser Cutting Foil

Find out here what benefits laser cutting of foils offers you for your application or processing of foils.

Laser Cutting Paper

Whether viewing windows in packaging, intricate contours for high-quality packaging, ultra-fast separation of paper webs - here we present profitable application solutions.

Laser scribing

Laser scribing is a process related to laser cutting. Find out here about the predestined areas of application and application solutions.

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